Taiwan Union Technology Corporation (TUC) was established in 1974. Its former name was Taiwan Union Glass Industrial Co., Ltd, mainly produced optical glass. In 1997, the company changed into producing Copper Clad Laminate (also called CCL) and Prepreg. In 2001, TUC started to provide Mass Lamination service for customers. In Dec., 2003, TUC was officially…
RO4360G2 laminates are 6.15 Dk, low loss, glass-reinforced,hydrocarbon ceramic-fi lled thermoset materials that provide the ideal balance of performance and processing ease. RO4360G2 laminates extend Rogers’ portfolio of high performance materials by providing customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer PCB board constructions, while…
RO4000® hydrocarbon ceramic laminates are designed to off er superior high frequency performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes off ered at competitive prices. The selection of laminates typically available to designers is signifi cantly reduced once operational frequencies increase…
The PCB silk screen layer is the top layer in the PCB and is generally used for annotations. The correct principle for the layout of the characters on the silk screen layer is: “no ambiguity, stitches at a glance, beautiful and generous”. This is to facilitate PCB assembly and maintenance, etc., to print the required…
S1000-2m is a high Tg product of Shengyi Technology Co., Ltd. (tg170 °C) and FR-4 material. It has lead-free adaptability to high multilayer. It is widely used in automobile, HDI PCB and various high-end electronic circuit boards in the industry. It is famous for its stable performance, convenient processing and fast delivery. Characteristic …
There are PCB prototype boards and Complex PCB boards. It is unnecessary to say that the prototype of a simple PCB is easy, but if it is a complex PCB prototype, you should be careful. If you do not use relevant testing tools to detect PCB prototype design, if there is a problem, it will…
Specifically formulated to have FR-4 matched dielectric constant (Dk),design transition to Kappa 438 laminates will be effortless. These laminates also exhibit low loss, tight Dk and thickness tolerances needed to meet the growing performance needs of the wireless market traditionally served by higher end FR-4 materials. Demand for wireless data is growing exponentially, driving a…
RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.RO3000 series laminates are ceramic-filled PTFE based circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This…
RT/duroid®6006/6010LM microwave laminates are ceramic PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15 and RT/ Duroid 6010LM laminate has a dielectric constant of 10.2. RT/Duroid 6006/6010LM microwave laminates feature ease of fabrication and stability in use. They…
Both RO4350b PCB and RO4835 PCB belong to Rogers 4000 series PCB and belong to civil products. Ro4000 series is a kind of laminated material of hydrocarbon resin and ceramic materials. It has the ability of compatible with FR4 mixed pressing, FR-4 processing technology and lead-free welding process. It ensures that PCB processing plant only…
Oxidation affects all thermoset laminate materials over time and temperature, including FR-4. In the long term, oxidation can lead to small increases in dielectric constant and dissipation factor of the circuit substrate. The rate of change and impact on circuit performance depends on design and operating temperature. For applications demanding greater stability at elevated temperatures…
RT/duroid®6002 microwave material was the first low loss and low dielectric constant laminate to offer superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable. The thermal coefficient of dielectric constant is extremely low from -55°C to+150°C (-67°F to 302°F) which provides the designers of filters,…
In modern electronics, high frequency Printed Circuit Boards (PCBs) have become an integral part of wireless communication, RF (Radio Frequency), microwave, and many other high-frequency applications. The choice of the right high-frequency PCB material is crucial to ensure circuit performance and reliable signal transmission. In this regard, Rogers RT / Duroid 5880 is a highly…
OSP (organic solvency preservation) is a kind of organic film grown by chemical method on the clean bare copper surface. This film has anti-oxidation, heat shock resistance and moisture resistance, which is used to protect the copper surface from further rusting (oxidation or vulcanization, etc.) in the normal environment. However, in the subsequent welding high…
Materials and plating Description Materials Plating Body Stainless steel Passivation Contact pin Beryllium copper C17300 Gold Plating Insulator UNFILLED ULTEM 1000 PEI/PTFE N/A Specification Electrical parameters Impedance 50 Ohm Frequency range DC~65GHz Voltage rating 150 V(rms) Dielectric withstanding voltage >500V Center contact resistance <4.0mΩ Outer contact resistance <2.5mΩ Insulation resistance >5000MΩ Insertion loss <.10 sqrt(f(GHz)) dB…
RF PCB design is often described as a kind of “black art” because there are many uncertainties in theory. However, this view is only partially correct. There are many rules that can be followed and rules that should not be ignored in RF PCB design. The following is a summary of the conditions that must…
