Every year, mobile communications have a new generation of revolutionary technologies that drive innovation in information and communication technologies, industries and applications. From 1G to 2G mobile communication technology has completed the transition from analog to digital; from 2G to 3G, the data transmission capability has been significantly improved, the peak rate can reach 2Mbps to tens of Mbps; from 3G to 4G, the peak rate is further increased to 100Mps to At 1Gbps, 5G is expected to provide peak bandwidth above 10Gbps, millisecond delay and ultra-high-density connectivity, effectively supporting applications such as virtual display, Internet of Things, and Internet of Vehicles.
From the perspective of the domestic development process, in 2013, the Ministry of Industry and Information Technology, the National Development and Reform Commission, and the Ministry of Science and Technology jointly promoted the establishment of the 5G promotion group. 5G first wrote the “Government Work Report” in 2017, and it is expected that the 5G global communication standard will be expected to fall in June 2018; In 2019, 5G pre-commercial, scale construction will start; 5G will be fully commercialized in 2020.
Communication is the largest downstream application market for PCBs. Printed circuit boards for communication are widely used in wireless networks, transmission networks, data communications, and fixed-line broadband. Related PCB products include backplanes, high-speed multilayer boards, high-frequency microwave boards, and multi-function metal substrates.
At Accelerated Assemblies, we manufacture printed circuit board for dense RF communication applications. A variety of materials can be chosen to meet your specific requirements. Generally, we recommend high grade fiber optics, PTFE, polyimide, and fiberglass, amongst others.
Application Field |
Major Equipment |
Related PCB Products |
Feature |
Wi-Fi |
Communication base station |
Backboard, high-speed multilayer board, |
Metal based, large size, high multilayer, |
Transmission network |
OTN transmission equipment, |
Backboard, high-speed multilayer board, |
High-speed materials, large size, |
|
Routers, switches, services/storage devices |
Backboard, high speed multilayer board |
High-speed materials, large size, |
Fixed network broadband |
OLT, ONU and other fiber-to-the-home devices |
Backboard, high speed multilayer board |
Multi-layer board, rigid-flexible PCB |