[email protected] +86-755-33583558 Ext 603


Every year, mobile communications have a new generation of revolutionary technologies that drive innovation in information and communication technologies, industries and applications. From 1G to 2G mobile communication technology has completed the transition from analog to digital; from 2G to 3G, the data transmission capability has been significantly improved, the peak rate can reach 2Mbps to tens of Mbps; from 3G to 4G, the peak rate is further increased to 100Mps to At 1Gbps, 5G is expected to provide peak bandwidth above 10Gbps, millisecond delay and ultra-high-density connectivity, effectively supporting applications such as virtual display, Internet of Things, and Internet of Vehicles.

From the perspective of the domestic development process, in 2013, the Ministry of Industry and Information Technology, the National Development and Reform Commission, and the Ministry of Science and Technology jointly promoted the establishment of the 5G promotion group. 5G first wrote the “Government Work Report” in 2017, and it is expected that the 5G global communication standard will be expected to fall in June 2018; In 2019, 5G pre-commercial, scale construction will start; 5G will be fully commercialized in 2020.

Communication is the largest downstream application market for PCBs. Printed circuit boards for communication are widely used in wireless networks, transmission networks, data communications, and fixed-line broadband. Related PCB products include backplanes, high-speed multilayer boards, high-frequency microwave boards, and multi-function metal substrates.

At Accelerated Assemblies, we manufacture printed circuit board for dense RF communication applications. A variety of materials can be chosen to meet your specific requirements. Generally, we recommend high grade fiber optics, PTFE, polyimide, and fiberglass, amongst others.

Communication PCB Application and Features

Application Field

Major Equipment

Related PCB Products



Communication base station

Backboard, high-speed multilayer board,
high-frequency microwave board,
multi-function metal substrate

Metal based, large size, high multilayer,
high frequency materials and mixed pressure

Transmission network

OTN transmission equipment,
microwave transmission equipment

Backboard,  high-speed multilayer board,
high-frequency microwave board

High-speed materials, large size,
high multi-layer, high density,
multiple back-drilling, rigid-flexible combination,
high-frequency materials and mixed pressure

data communication

Routers, switches, services/storage devices

Backboard, high speed multilayer board

High-speed materials, large size,
high multi-layer, high density,
multiple back-drilling, rigid-flexible PCB

Fixed network broadband

OLT, ONU and other fiber-to-the-home devices

Backboard, high speed multilayer board

Multi-layer board, rigid-flexible PCB


  • TEL:+86-755-33583558 Ext 603
  • EMAIL:[email protected]
  • ADDRESS:Add: 407, Kanglan Fortune Center, Fuzhou Avenue, Fuyong Street, Baoan District, Shenzhen, Guangdong 518103, China