High Speed PCB with Impedance Control Impedance Control PCB refers to the PCB that needs impedance control. Impedance control refers to the “resistance” generated by a certain circuit layer under its …
Among the large-scale use of PCI and optical modules and cable sockets, the gold fingers PCB has been divided into: long and short gold fingers, broken gold fingers, and split gold fingers. Gold finge…
What is Via In Pad The holes drilled on the chip pads on the PCB can be referred to as VIA IN PAD. In the manufacturing process, after the via plating, the resin is filled and then the surface is plat…
What is High Tg PCB When the temperature rises to a certain area, the substrate will change from “glass state” to “rubber state”, and the temperature at this time is called the glass transition temper…
Half hole pcb The walls of the PTH holes on the PCB are plated with Half-hole formed by smooth and complete metal forming.The Half hole process on the edge of the board is already a mature process in …
Thick Copper PCB Difinition and Thickness There is no exact definition of thick copper in the PCB industry. Generally, the copper thickness ≥ 2oz is defined as Heavy copper PCB. Heavy copper PCB is ma…
Hard Gold PCB, immersion gold PCB, is to immerse the board in the plating tank and apply current to form a nickel-gold coating on the copper foil surface of the board. The electro-nickel gol…
Feature | Capability |
Quality Grade | Standard IPC 2 |
Number of Layers | 1 - 40layers |
Order Quantity | 1pcs - 10,000,000 pcs |
Build Time | 2days - 5weeks (Expedited Service) |
Material | FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C FR4-Halogen-free, FR4-Halogen-free & High-Tg |
Board Size | Min 6*6mm | Max 600*700mm |
Board size tolerance | ±0.1mm - ±0.3mm |
Board Thickness | 0.4mm - 3.2mm |
Board Thickness Tolerance | ±0.1mm - ±10% |
Copper Weight | 0.5oz - 6.0oz |
Inner Layer Copper Weight | 0.5oz - 2.0oz |
Copper Thickness Tolerance | +0μm +20μm |
Min Tracing/Spacing 3mil/3mil | 3mil/3mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Blue, Black, Red, Yellow |
Surface Finish | HASL - Hot Air Solder Leveling |
Lead Free HASL | RoHS |
ENIG - Electroless Nickle/Immersion Gold | RoHS |
ENEPIG - Electroless Nickel Electroless Palladium Immersion Gold | RoHS |
Immersion Silver | RoHS |
Immersion Tin | RoHS |
OSP -Organic Solderability Preservatives | RoHS |
Min Annular Ring | 3mil |
Min Drilling Hole Diameter | 6mil, 4mil-laser drill |
Min Width of Cutout (NPTH) | 0.8mm |
NPTH Hole Size Tolerance | ±.002" (±0.05mm) |
Min Width of Slot Hole (PTH) | 0.6mm |
PTH Hole Size Tolerance | ±.003" (±0.08mm) - ±.006" (±0.15mm) |
Surface/Hole Plating Thickness | 20μm - 30μm |
SM Tolerance (LPI) . | 003" (0.075mm) |
Aspect Ratio | 1.10 (hole size: board thickness) |
Test 10V - 250V, flying probe or testing fixture | |
Impedance tolerance | ±5% - ±10% |
SMD Pitch | 0.2mm(8mil) |
BGA Pitch | 0.2mm(8mil) |
Chamfer of Gold Fingers | 20, 30, 45, 60 |
Other Techniques | Gold fingers, Blind and Buried Holes, peelable solder mask, Edge plating, Carbon Mask, Kapton tape, Countersink/counterbore hole, Half-cut/Castellated hole, Press fit hole, Via tented/covered with resin, Via plugged/filled with resin, Via in pad, Electrical Test |