Specifically formulated to have FR-4 matched dielectric constant (Dk),design transition to Kappa 438 laminates will be effortless. These laminates also exhibit low loss, tight Dk and thickness tolerances needed to meet the growing performance needs of the wireless market traditionally served by higher end FR-4 materials. Demand for wireless data is growing exponentially, driving a…
RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.RO3000 series laminates are ceramic-filled PTFE based circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This…
RT/duroid®6006/6010LM microwave laminates are ceramic PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15 and RT/ Duroid 6010LM laminate has a dielectric constant of 10.2. RT/Duroid 6006/6010LM microwave laminates feature ease of fabrication and stability in use. They…
Both RO4350b PCB and RO4835 PCB belong to Rogers 4000 series PCB and belong to civil products. Ro4000 series is a kind of laminated material of hydrocarbon resin and ceramic materials. It has the ability of compatible with FR4 mixed pressing, FR-4 processing technology and lead-free welding process. It ensures that PCB processing plant only…
Oxidation affects all thermoset laminate materials over time and temperature, including FR-4. In the long term, oxidation can lead to small increases in dielectric constant and dissipation factor of the circuit substrate. The rate of change and impact on circuit performance depends on design and operating temperature. For applications demanding greater stability at elevated temperatures…
RT/duroid®6002 microwave material was the first low loss and low dielectric constant laminate to offer superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable. The thermal coefficient of dielectric constant is extremely low from -55°C to+150°C (-67°F to 302°F) which provides the designers of filters,…
In modern electronics, high frequency Printed Circuit Boards (PCBs) have become an integral part of wireless communication, RF (Radio Frequency), microwave, and many other high-frequency applications. The choice of the right high-frequency PCB material is crucial to ensure circuit performance and reliable signal transmission. In this regard, Rogers RT / Duroid 5880 is a highly…
OSP (organic solvency preservation) is a kind of organic film grown by chemical method on the clean bare copper surface. This film has anti-oxidation, heat shock resistance and moisture resistance, which is used to protect the copper surface from further rusting (oxidation or vulcanization, etc.) in the normal environment. However, in the subsequent welding high…
Materials and plating Description Materials Plating Body Stainless steel Passivation Contact pin Beryllium copper C17300 Gold Plating Insulator UNFILLED ULTEM 1000 PEI/PTFE N/A Specification Electrical parameters Impedance 50 Ohm Frequency range DC~65GHz Voltage rating 150 V(rms) Dielectric withstanding voltage >500V Center contact resistance <4.0mΩ Outer contact resistance <2.5mΩ Insulation resistance >5000MΩ Insertion loss <.10 sqrt(f(GHz)) dB…
RF PCB design is often described as a kind of “black art” because there are many uncertainties in theory. However, this view is only partially correct. There are many rules that can be followed and rules that should not be ignored in RF PCB design. The following is a summary of the conditions that must…
SLP is short for substrate-like PCB. It is the next generation of rigid pcb board, which can shorten the line width / line spacing from 40 / 50 μ m of HDI to 20 / 35 μ m, that is to say, the minimum line width / line spacing will be shortened from 40 μ…
If you are just starting to study the design of IOT products, there are many design aspects that need to be improved. IOT devices integrate mobility, low power consumption, RF communication, mixed signal functions and high-speed data transmission functions into a small space. Keeping all these factors in mind will help you design correctly in…
The rapid development of electronic industry promotes the rapid development of many industries. In recent years, electronic products are more and more widely used in automobile industry. The traditional automotive industry has made more efforts in mechanics, power, hydraulics and transmission. However, the modern automotive industry relies more on electronic applications which play an increasingly…
As a hardware engineer, project director and small boss, are you still worried about PCB layout? PCB layout is difficult to say, easy to say, and not easy to say. In addition to the EE engineer’s schematic diagram, layout is also very important for product quality. Wiring rationality, impedance matching, machinability, EMI, EMC considerations, test…
HDI PCB is a printed circuit board designed to maximize the density of surface components, provide breakthrough solutions and / or transmit high-frequency signals for ICs with a large number of closely spaced pins or pads. The aim is to provide greater functionality in smaller packages. To achieve this goal, you need to select a…
The progress of printed circuit board technology is promoting the development of electronic industry. Whether it's providing solutions that are changing our homes and workplaces, or offering smaller products that increase ease of use, have a profound impact. Although the macro trend of electronic industry has been driven by the development of Internet of…
