With the development of light, thin, small, high-density and multi-functional electronic products, the density and integration of components on printed boards are getting higher and higher, power consumption is getting larger and larger, and demanding of the heat dissipation requirements of PCB substrates are becoming more and more urgent. If the heat dissipation of the substrate is not good, the components on the printed circuit board will be overheated, which will reduce the reliability of the whole machine. In this context, a high-heat-dissipation custom MCPCB
The most widely used in custom MCPCB is aluminum-based copper clad laminates. The product was invented by Japan's Sanyo National Policy in 1969 and was applied to the STK series of power amplifier hybrid integrated circuits in 1974. In the early 1980s, China's metal-based copper clad laminates were mainly used in finished products. At that time, the metal PCB substrate material was completely dependent on imports and was expensive. In the mid-to-late 1980s, with the extensive use of aluminum-based copper clad laminates in automotive and motorcycle electronic products and the expansion of usage, China's custom MCPCB research and manufacturing technology has been developed and is widely used in many fields such as electronics, telecommunications, and electric power.