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Advantages and Disadvantages of Custom MCPCB

MCPCB refers to Metallic PCB (MCPCB). That is, the original printed circuit board is attached to another metal with better heat conduction effect, which can improve the heat dissipation of the board layer.

According to the type of application, it can be divided into three categories:

(1) Universal aluminum-based copper clad laminate. The insulating layer is composed of an epoxy glass cloth bonding sheet;

(2) High thermal conductivity type aluminum-based copper clad laminate. The insulating layer is composed of a highly thermally conductive epoxy resin or other resin;

(3) High-frequency, microwave-type aluminum-based copper clad laminates. The insulating layer is composed of a polyolefin resin or a polyimide resin glass cloth bonding sheet.

However, custom MCPCB has some limitations. When the circuit system is in operation, it should not exceed 140 °C. This is mainly due to the limitation of the characteristics of the Dielectric Layer (Insulated Layer). In addition, it must not exceed 250 °C ∼300 °C during the manufacturing process. The tin furnace must be known beforehand.

Although the custom MCPCB has better heat dissipation than the FR4 PCB, the dielectric layer of the custom MCPCB does not have a very good thermal conductivity. It has a conduction bottleneck between the heat sink and the metal core board. However, it is still better than FR4 PCB. The existing MCPCB can reach 3W/m.K, while the FR4 is only 0.3W/m.K.

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