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Screen Printing Technology for High Density Multilayer Flexible Printed Circuit Board

Screen Printing Technology for High Density Multilayer Flexible Printed Circuit Board

Today, the PCB industry has released a technology that can produce high density multi-layer flexible printed circuit boards by screen printing, which is also a leading technology in the PCB industry. With this screen printing technology, the multi-layer high density flexible printed circuit board embedded in components can be printed and processed completely. Width (L) / distance (S) of conductor can reach 30 micron/30 micron, and diameter of through hole can be machined to 80 micron. In addition to directly embedding passive components such as resistors, capacitors and inductors, active components can also be processed and embedded by semiconductor materials. This screen printing technology can produce sheet by sheet in batch and roll in roll.

The business scope of Shenzhen KeyPCB Co., Ltd. includes R&D and sales of circuit boards and soft circuit boards; R&D, scheme design, technical service and sales of electronic components, electronic products, computer software and hardware and network technology; and operation of import and export business. (Except for projects prohibited by laws, administrative regulations and decisions of the State Council, restricted projects can only be operated after obtaining permission.). Manufacturing of electronic components, electronic products, computer hardware and software and network technology. Welcome to inquire!

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