How does the lamination of multi-layer FPC flexible PCB accomplish? What is the difference between the lamination of multi-layer FPC flexible PCB and traditional rigid PCB? Following is a brief introduction of multi-layer FPC lamination technology.
First of all, the multi-layer soft PCB lamination process flow: lamination, die opening, feeding, die closing, pre-pressing, forming, cooling die opening, blanking, inspection, next process.
A. Clean the surface dust and debris of the stripping film, steel plate, silica gel and sticky dust cloth or paper before production.
B. Open the size of the separating film well (500m*500m) and place it in the laminated area for reserve, and 400 pieces of steel plate are needed after each lamination cycle, so that the production can continue without breakage.
C. When laminating, gloves should be worn on both hands or finger gloves should be worn on five fingers. No bare hands should be allowed to touch the soft board.
D. Place steel plate, silica gel, release film, soft PCB, release film before laminating. The following points should be paid attention to when laminating flexible circuit boards:
When laminating, gloves or finger gloves must be worn to prevent the stratification caused by surface contamination.
Before lamination, check whether the steel plate is uneven, whether the silica gel is damaged, cracks, bee eyes, and whether there is garbage on the release film.
Only steel platesilica gelseparating film without above undesirable phenomena can be used in production.
The position and graphics of FPC (Flexible Circuit Board) should be consistent when stacking.
When releasing the membrane, the positive and negative sides of the membrane must be confirmed first.
1. Use an oily pen to mark the corner of the release film. If the handwriting is clearly negative, it is not clear that it is positive.
2. Wearing white gloves to touch the release film, there is a smooth and logical side for the positive side, and vice versa.
Laminating operation production process: film removal – Pretreatment – bonding – pressing – plating
Laminating process: drill hole – BS film – superplastic – pressed base material – deposited copper
Strict manufacturers of flexible circuit boards must complete every step of operation in accordance with the regulations.
Basic structure of FPC soft circuit board
In recent years, with the popularity of mobile products such as smartphones and tablets, flexible PCB boards, which were not known by many people, have been used more and more, while many people do not know much about the structure of FPC.
From the combination of flexible circuit board substrate and copper mooring, it can be roughly divided into flexible circuit board with glue and flexible circuit board without glue.
First of all, talk about non-glue products. The price of non-glued FPC flexible board is much more expensive than that of glued material, mainly because the processing of non-glued base material is difficult and complex. But as far as performance is concerned, the adhesive-free FPC is better than the adhesive product in terms of the bonding force between copper foil and base material and the smoothness of welding pad, and its flexibility is also better than the adhesive product. Therefore, it is mainly applied to some products with high performance requirements.
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