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Development of Printed Circuit Board Material

Development of Printed Circuit Board Material

The basic characteristics of printed circuit board depend on the performance of the substrate, to improve the technical performance of printed circuit board must first improve the performance of printed circuit board, the basic characteristics of PCB depend on the performance of PCB. To improve the technical performance of PCB, it is necessary to improve the performance of PCB. In order to meet the needs of PCB development, various new materials are gradually developed and put into use.

In recent years, PCB market has shifted from computer to communication, including base stations, servers and mobile terminals. Mobile communication devices represented by smart phones have driven PCB to develop toward higher density, thinner and higher functions. Printed circuit technology can not be separated from the substrate material, which also involves the technical requirements of PCB substrate. Now the related content of the substrate material is arranged into a special paper for the reference of CCL industry.

1. Demand for high density fine linearization

PCB is developing toward high density and fine linearization, especially HDI board. Ten years ago, IPC defined HDI board as line width/line spacing (L/S) of 0.1mm/0.1mm or less. Now the industry basically achieves the conventional L/S of 60 microns and the advanced L/S of 40 microns. Japan's 2013 version of installation technology roadmap data HDI board routine L/S is 50 microns, advanced L/S is 35 microns, trial-produced L/S is 20 microns.

2. High frequency and high speed requirements

Electronic communication technology from wired to wireless, from low-frequency, low-speed to high-frequency, high-speed. Now the mobile phone performance has entered 4G and will move towards 5G, which means faster transmission speed and larger transmission capacity. With the advent of global cloud computing era, data traffic has multiplied, and high-frequency and high-speed communication equipment is an inevitable trend. In order to meet the needs of high frequency and high speed transmission, it is important to have high performance substrates besides reducing signal interference and loss in circuit design, maintaining signal integrity and keeping PCB manufacturing in line with design requirements.

3. Requirements for high heat resistance and heat dissipation

With the miniaturization and high-functionality of electronic equipment, high heat generation, and the increasing demand for thermal management of electronic equipment, one of the solutions chosen is to develop thermal conductive printed circuit boards (PCBs). The primary condition of PCB for heat resistance and heat dissipation is the heat resistance and heat dissipation of PCB. At present, the heat resistance and heat dissipation of PCB are improved to a certain extent by resin modification and filler addition, but the improvement of thermal conductivity is very limited. Typically, the use of metal substrates (IMS) or metal core printed circuit boards (PCBs) plays a role in heat dissipation of heating components, reducing the volume and cost of cooling compared with traditional radiators and fans.

Polytetrafluoroethylene (PTFE) PCB manufacturers should produce high density and lighter substrates to lay the foundation for the development of printed circuit boards in China.

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