Copper prototype board
is a kind of thermal conductivity than aluminum substrate and iron substrate are many times better metal substrate, suitable for high frequency circuits and high and low temperature change of large areas and precision communication equipment heat dissipation and construction decoration industry, generally sunken gold copper substrate, silver copper substrate, tin copper substrate, copper oxide substrate.
Copper prototype board circuit layer requires a large current-carrying capacity, so should use thick copper foil, the thickness of the general 35 m~280 m; Thermal insulation layer is the core technology of copper substrate. The core thermal conductivity component is composed of aluminum oxide and silicon powder and epoxy resin filled polymer, with small thermal resistance (0.15), excellent viscoelastic properties, thermal aging resistance and mechanical and thermal stress tolerance.
Copper prototype board metal base is the support member of copper substrate, which requires high thermal conductivity, generally copper, copper plate can also be used (copper plate can provide better thermal conductivity), suitable for drilling, punching and cutting and other conventional mechanical processing.
Double-sided copper substrate is generally divided into three layers:
The first layer for the circuit (conductive).
The second layer is heat transfer.
The third layer ACTS as a secondary conduction of the heat derived from the heat-conducting insulating material.