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Temperature Pressing Process of PTFE - Based PCB Coated Board

Printed circuit board is an important electronic component, the support of electronic components, and the carrier of electrical connection of electronic components. With the continuous progress of electronic information technology, high-frequency electronic equipment is the trend of development, and information products are constantly moving towards high-speed and high-frequency. The development of new generation products requires high-frequency PCB boards, especially for satellite systems, mobile phone receiving base stations and other communication products. With the rapid development of these applications in the next few years, there will be a large demand for high-frequency PCB board. It is an important electronic component, the support of electronic components, and the carrier of electrical connection of electronic components. With the continuous progress of electronic information technology, high-frequency electronic equipment is the trend of development, and information products are constantly moving towards high-speed and high-frequency. The development of new generation products requires high-frequency PCB boards, especially for satellite systems, mobile phone receiving base stations and other communication products. With the rapid development of these applications in the next few years, there will be a large demand for high-frequency PCB board.

Poly tetra fluoroethylene (PTFE)

PTFE has excellent dielectric properties. It is the best organic material found so far. Excellent dielectric properties are conducive to the complete and fast transmission of signals. PTFE also has high heat resistance and weather resistance, which ensures that electronic equipment can work normally in harsh environments for a long time, such as exposure to outdoors, where the temperature difference is large. Therefore, PTFE-based copper clad laminate is one of the indispensable materials in military, aerospace and other fields.

Pressing and heating process:

Up to now, PTFE laminates are still limited to low layers, because it can not overcome the difficulties of repeated compression. These difficulties are mainly manifested in the thermoplasticity of the bonding film used to bond PTFE laminates together. Any temperature deviation (e.g. another pressing cycle) especially higher than its melting point tends to cause delamination. Therefore, some designers adopt two-step lamination method. For those three or more lamination operations, thermosetting or melt lamination must be used. The so-called melt lamination bonding is the high temperature lamination method of PTFE resin system. The lamination temperature is about 371 ℃. Then the maximum oil temperature of the thermal kerosene system should be set at least 390 ℃ to ensure the long-term stable operation of the thermal kerosene system under high temperature. This temperature has exceeded the working capacity of industrial laminating machinery, but it is an effective method of PTFE lamination bonding.

PTFE PCB manufacturers should increase R&D investment to upgrade the production technology level and produce high density and lighter substrates, so as to lay a foundation for the development of printed circuit boards in China.

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