Copper foil: It is basically divided into electrolytic copper and rolled copper. Common in thickness are 1oz 1/2oz and 1/3 oz.
Substrate film: It is commonly used in thicknesses of 1 mil and 1/2 mil.
Glue (adhesive): Thickness depends on customer requirements.
Cover film protection film: It is used for surface insulation. Common thickness is 1mil and 1/2mil.
Glue (adhesive): Thickness depends on customer requirements.
Release paper: It prevents the adhesive from sticking to foreign objects before pressing and easy to work.
Reinforcement plate: It reinforces the mechanical strength of FPC and facilitates surface mounting operations. Common thicknesses range from 3 mils to 9 mils.
Glue (adhesive): Thickness depends on customer requirements.
Release paper: It prevents the adhesive from sticking to foreign objects before pressing.
EMI: Electromagnetic shielding film protects the circuit inside the circuit board from external interference (strong electromagnetic area or susceptible area).
