service@pcbsky.com +86-755-33583558 Ext 603
What is LTCC package?

What is LTCC package?

LTCC stands for “Low Temperature Co-fired Ceramic.” It is a packaging technology commonly used in the electronics industry to create compact and reliable multi-layer circuits and components. LTCC packages are designed to handle a wide range of applications, including RF (Radio Frequency), microwave, and high-frequency modules, sensors, MEMS (Micro-Electro-Mechanical Systems), and other miniaturized electronic devices.


Key features and advantages of LTCC packages include:

  1. Multilayer Structure: LTCC packages are fabricated by stacking multiple layers of ceramic substrates, each with circuit traces, vias, and other necessary structures. These layers are stacked and bonded together using a low-temperature firing process, hence the name “Low Temperature Co-fired Ceramic.”
  2. Thermal Performance: LTCC packages have good thermal properties due to the ceramic material used. This makes them suitable for applications where heat dissipation is important, such as in high-frequency RF modules.
  3. Miniaturization: The layering process allows for the integration of multiple components and circuitry in a compact space, making LTCC packages ideal for miniaturized devices.
  4. Hermeticity: LTCC packages can be designed to provide a high level of hermeticity, which is essential for protecting sensitive electronics from environmental factors like moisture, dust, and contaminants.
  5. Customization: The LTCC process allows for the creation of complex three-dimensional structures, enabling the integration of various components, such as passive elements (resistors, capacitors, inductors), RF components (antennas, filters), and even small microfluidic channels for certain applications.
  6. High Frequency Applications: LTCC packages are commonly used in high-frequency applications due to their excellent electrical properties and minimal signal loss at high frequencies.
  7. Reliability: LTCC packages offer good mechanical and thermal stability, making them suitable for harsh operating environments.

LTCC packages are often used in conjunction with other technologies such as flip-chip bonding, wire bonding, and surface mount technology (SMT) to assemble and interconnect the various components onto the LTCC substrate.

Overall, LTCC packages are versatile solutions for a wide range of electronic devices that require compact size, high-frequency performance, and reliability in demanding environments.

Related Articles
  • TEL:+86-755-33583558 Ext 603
  • EMAIL:service@pcbsky.com
  • ADDRESS:Add: 407, Kanglan Fortune Center, Fuzhou Avenue, Fuyong Street, Baoan District, Shenzhen, Guangdong 518103, China