12 precision calculators for impedance, parasitics, thermal management, and signal integrity
PCB spiral & wire-wound coils – compute DC resistance from turns, shape, material resistivity, and cross‑section.
High-current traces (2–6+ oz). Required trace width based on current, ΔT, external/internal layer (IPC‑2221).
Trace current (IPC‑2221), clearance/creepage (voltage‑based), hole & pad (IPC‑7251).
Optimize thermal vias and copper pad area for effective heat spreading and junction temperature reduction.
Select inductor, output capacitor, and sense resistor for buck/boost converters. Ripple, stability & ESR.
Trace‑to‑trace (coplanar) and plane‑to‑plane capacitance. Fast EMI/crosstalk estimation.
Microstrip, stripline, and differential pairs. Z0, effective εr, and propagation delay for high‑speed design.
Round pin/lead, PCB trace, through‑hole via. Critical for power integrity and switching noise.
Optimize via dimensions, pad diameter, and antipad clearance for signal integrity & manufacturability.
Power Distribution Network – calculate target impedance, decoupling capacitance, and resonant peaks.
VSWR, return loss, impedance matching (L‑network), attenuation, and power conversion (dBm/W).
Propagation delay, phase shift, and electrical length for microstrip/stripline (ps/mm, degrees).