A company in the field of 3D printing electronics recently submitted a patent application to the U.S. Patent and Trademark Office. The patent application involves the installation of printed shielding wires in the process of a conventional printed circuit board (PCB) fabrication
It is known that the patent application for PCB power loss phenomenon proposed a solution, and the technology is mainly used in the communications industry.
As we all know, the communication industry needs high-speed data transmission, and the current high-speed circuit transmission speed can reach 60G-100G. In this process, PCB often suffers losses due to the crosstalk of conductive lines and the diversity of signals, which will interfere with the normal function of the circuit.
To solve this problem, a unique 3D printing method can create a protective layer of 3D printing to shield conductors, just like an insulated cable, which can be planted on printed circuit boards.
This innovative approach creates opportunities for minimizing the size of printed circuit boards used in high-speed communications.
By selectively depositing nano-sized conductive ink, the manufacturer can create a shield along the length of the entire wire at the smallest distance, thus preventing leakage and loss. This is somewhat similar to the use of shielded cables outside printed circuits. However, 3D printing technology implements the insertion of shielded cables into printed circuit boards.
High-speed circuit board is an indispensable part of the telecommunications industry, and it is also an important part of the fast server which can realize real-time large data. The birth of this technology is of great significance.